200W ALMINUM NITRIDE SUBSTRATES

200W ALMINUM NITRIDE SUBSTRATES

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200W(AIN-200)AlN ceramic substrate-200W

200W ALMINUM NITRIDE SUBSTRATES

Type of Product:

Note: larger size, smaller size, thinner thickness or thicker products or other special specifications products can be customized according to customer requirements to o do laser cutting process.

Tolerances for products

Thickness tolerance:

Note: Thickness tolerance of AlN can product according to customer’s requirement, but not less than ±0.01mm

Length*Width tolerance of laser process:

Materials Proper

200W ALMINUM NITRIDE SUBSTRATES

The Aluminum nitride ceramic substrate has a high thermal conductivity of 200W/m. K, high resistivity, low dielectric loss, good insulation, and some other excellent properties. The ALN substrate is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipment such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.

AlN substrate can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for cooling and protecting circuits, packages, and modules.
High Thermal Conductivity Aluminum Nitride Ceramic substrate

Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required. Because of it’s qualities, it is an ideal material for use in thermal management and electrical applications.
Some common applications of Aluminum Nitride include the following:
Heat sinks & heat spreaders Electrical insulators for lasers Chucks, clamp rings for semiconductor processing equipment Electrical insulators Silicon wafer handling and processing Substrates & insulators for microelectronic devices & opto electronic devices Substrates for electronic packages Chip carriers for sensors and detectors Chip lets Col lets Laser heat management components Molten metal fixtures Packages for microwave devices.
200W ALMINUM NITRIDE SUBSTRATES
Features
 * Very high thermal conductivity (> 200 W/mK)

* High electrical insulation capacity (>1.1012Ωcm)

* Strength according to the double ring method >320 MPa (biaxial strength)

* Low thermal expansion 4 to 6×10-6K-1(between 20 and 1000°C)

* Good metalization capacity

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