With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for
applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
Advantages:
· High thermal conductivity combined with good electrical insulation characteristics.
· Exceptional stability when exposed to many molten salts.
· Thermal stability up to at least 1500°C
· Favorable mechanical characteristics extending into the high temperature range.
· Low thermal expansion and resistance to thermal shock.
· Special optical and acoustic characteristics.

· Flexural strength is 300 ± 5MPa
· Coefficient of thermal expansion is 5.6×10-6K-1 (20-1000°C)
· Thermal conductivity is 70-180 W/m.K
· Insulation resistance is >1012Ωcm (20°C)

Products:
· AlN Ceramic Heat-sinks for high power system
· AlN Crucible for Metal Melting
· AlN Ceramic Rod
· AlN Ceramic Heater
· Ceramic Substrate
· Custom Shape