Aluminum nitride ceramic substrate, high thermal conductivity, low coefficient of expansion, high strength, high temperature
resistance, chemical resistance, high resistivity , low dielectric loss, is the ideal LSI heat dissipation board and packaging
materials.
ALN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs crystal crucible, Al evaporation pan,
MHD power generation equipment and high temperature turbine corrosion resistant parts, using its optical properties can be used as
an infrared window.

Aluminum Nitride (ALN) is a ceramic material with outstanding properties such as high thermal conductivity and high electrical
resistance. In addition, it is featured with advantages such as high hardness, corrosion resistant, low dielectric loss and low
CTE.