Erosion Resistant Aluminum Nitride AlN Ceramic Rod
- Description
- Inquiry
Erosion Resistant Aluminum Nitride AlN Ceramic Rod
The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low
dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic,
high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is
widely used in communication components, high power led, power electronic devices and other
fields.Special spec products can be produced upon requests.
PRODUCT PERFORMANCE
– High thermal conductivity, high flexural strength, high temperature
– Good electrical insulation
– Low dielectric constant and loss
– Able to be laser drilled, metallized, plated and brazed
Aluminum Nitride is one of the few materials that offers electrical insulation and high thermal conductivity. This makes AlN extremely useful in high power electronic applications in heat sink and heat spreader applications.
Product Features
1.Uniform microstructure
2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives
3.High electrical resistivity
4.Thermal expansion coefficient close to that of Silicon
5.Resistance to corrosion and erosion
6.Excellent thermal shock resistance
7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation
occurs around 780°C; the surface layer protects the bulk up to 1380°C).
Property | Unit | Alumina Nitride Ceramic |
Color | Grey | |
Mechanical Properties | ||
Density | g/cm3 | 3.31 |
Compressive Strength | MPa | 2100 |
Flexural Strength | MPa | 335 |
Vickers Hardness | GPa | 11 |
Thermal Properties | ||
Maximum Temperature | ||
Oxidizing | °C | 700 |
Inert | °C | 1300 |
Thermal Conductivity | 30 | |
@ 25°C | W/mK | 180 |
@ 300°C | W/mK | 130 |
Coefficient of Expansion | ||
CTE 25°C ➞ 100°C | 10^-6/°C | 3.6 |
CTE 25°C ➞ 300°C | 10^-6/°C | 4.6 |
CTE 25°C ➞ 500°C | 10^-6/°C | 5.2 |
CTE 25°C ➞ 1000°C | 10^-6/°C | 5.6 |
Specific Heat | 100°C | 750 |
Thermal Shock Resistance ΔT | °C | 400 |
Electrical Properties | ||
Dielectric Constant | 1 MHz | 8.6 |
Dielectric Strength | kV/mm | >15 |
Loss Tangent | 1 MHz | 5×10^-4 |
- Heat sinks & heat spreaders
- Electrical insulators for lasers
- Chucks, clamp rings for semiconductor processing equipment
- Electrical insulators
- Silicon wafer handling and processing
- Substrates & insulators for microelectronic devices & opto electronic devices
- Substrates for electronic packages
- Chip carriers for sensors and detectors
- Chiplets
- Collets
- Laser heat management components
- Molten metal fixtures
- Packages for microwave devices