Fine polishing alumina nitride sheet

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Fine polishing alumina nitride sheet
Product Description
customized aluminium nitride heat dissipation ceramic substrate/ceramic sheet/ ceramic substrate for circuit board
Application: abrasion resistant lining patch; patch type electronic component substrate; computer accessories.
strong current, strong voltage, high temperature and easy wear parts of electronic appliances and mechanical equipment.

Features
 * Very high thermal conductivity (> 200 W/mK)

* High electrical insulation capacity (>1.1012Ωcm)

* Strength according to the double ring method >320 MPa (biaxial strength)

* Low thermal expansion 4 to 6×10-6K-1(between 20 and 1000°C)

* Good metalization capacity
Specification
Some common applications of Aluminum Nitride include the following:
Heat sinks & heat spreaders Electrical insulators for lasers Chucks, clamp rings for semiconductor processing equipment Electrical insulators Silicon wafer handling and processing Substrates& insulators for microelectronic devices & opto electronic devices Substrates for electronic packages Chip carriers for sensors and detectors Chip lets Col lets Laser heat management components Molten metal fixtures Packages for microwave devices.
Properties Sheet
Property
Unit
Alumina Nitride Ceramic
Color
Grey
Mechanical Properties
Density
g/cm3
3.31
Compressive Strength
MPa
2100
Flexural Strength
MPa
335
Vickers Hardness 
GPa
11
Thermal Properties
Maximum Temperature
Oxidizing
°C
700
Inert
°C
1300
Thermal Conductivity 
30
@ 25°C
W/mK
180
@ 300°C
W/mK
130
Coefficient of Expansion
CTE 25°C ➞ 100°C
10^-6/°C
3.6
CTE 25°C ➞ 300°C
10^-6/°C
4.6
CTE 25°C ➞ 500°C
10^-6/°C
5.2
CTE 25°C ➞ 1000°C
10^-6/°C
5.6
Specific Heat
100°C
750
Thermal Shock Resistance ΔT
°C
400
Electrical Properties
Dielectric Constant
1 MHz
8.6
Dielectric Strength 
kV/mm
>15
Loss Tangent
1 MHz
5×10^-4
Fine polishing alumina nitride sheet
Alumina Nitride Applications
  • Heat sinks & heat spreaders
  • Electrical insulators for lasers
  • Chucks, clamp rings for semiconductor processing equipment
  • Electrical insulators
  • Silicon wafer handling and processing
  • Substrates & insulators for microelectronic devices & opto electronic devices
  • Substrates for electronic packages
  • Chip carriers for sensors and detectors
  • Chiplets
  • Collets
  • Laser heat management components
  • Molten metal fixtures
  • Packages for microwave devices

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