Heat Dissipation Structure Aluminum Nitride Ceramic Components

Heat Dissipation Structure Aluminum Nitride Ceramic Components

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Heat Dissipation Structure Aluminum Nitride Ceramic Components

With highly thermal conductivity ceramic heat dissipation components made from aluminum nitride for thermal management of high-power electronics, photovoltaic, automotive, LED and other applications.

About Aluminum Nitride Ceramics

Aluminum Nitride (AlN) Ceramics is an excellent ceramic material to use if high thermal conductivity and electrical insulation properties are required, making it an ideal material for use in thermal management and electrical applications.

Aluminum Nitride Ceramic has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.

Properties of Aluminum Nitride Ceramics

  • High thermal conductivity

  • Low coefficient of thermal expansion

  • Good electrical insulation and resistivity

  • Low dielectric constant

  • High mechanical strength under compression load

  • Corrosion resistant (gas)

  • Good thermal shock resistance

Applications of Aluminum Nitride Ceramics

  • Heat sinks & heat spreaders
  • Electrical insulators for lasers
  • Chucks, clamp rings for semiconductor processing equipment
  • Electrical insulators
  • Silicon wafer handling and processing
  • Substrates & insulators for microelectronic devices & opto electronic devices
  • Substrates for electronic packages
  • Chip carriers for sensors and detectors
  • Chiplets
  • Collets
  • Laser heat management components
  • Molten metal fixtures
  • Packages for microwave devices

 

Heat Dissipation Structure Aluminum Nitride Ceramic Components

Properties
Units
Value
Color
Grey
Mechanical Properties
Density
g/cm3
3.30
Modulus of Elasticity
GPa
310
Fracture toughness
Mpa x m^1/2
3.5
Poissons Ratio
0.25
Compressive Strength
MPa
2100
Flexural Strength
MPa
335
Hardness (Knoop 100 g)
Kg/mm2
1170
Hardness (Vickers)
GPa
11
Thermal Properties
Maximum Temperature
Oxidizing
°C
700
Inert
°C
1300
Thermal Conductivity
@ 25°C
W/mK
180
@ 300°C
W/mK
130
Specific Heat
J/kg.K
750
Thermal Shock Resistance ΔT
°C
400
Coefficient of Expansion
CTE 25°C ➞ 100°C
10^-6/°C
3.6
CTE 25°C ➞ 300°C
10^-6/°C
4.6
CTE 25°C ➞ 500°C
10^-6/°C
5.2
CTE 25°C ➞ 1000°C
10^-6/°C
5.6
Electrical Properties
Dielectric Constant
1 MHz
8.6
Loss Tangent
1 MHz
5×10^-4
Dielectric Strength
kV/mm
>15
Volume Resistivity
25°C
Ω cm
>10^13
300°C
Ω cm
10^9
500°C
Ω cm
10^7

 

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