High Thermal Conductivity Hexagonal Boron Nitride Ceramic Cylinder

High Thermal Conductivity Hexagonal Boron Nitride Ceramic Cylinder

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High Thermal Conductivity Hexagonal Boron Nitride Ceramic Cylinder

Hexagonal Boron Nitride rod has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

Boron nitride can be long-term used at 1800 degrees under vacuum atmosphere. With gas protection, Boron Nitride can be used at 2100°. Boron Nitride is with high thermal shock resistance, no cracks under extreme cold & high temperature. If you take out Boron Nitride from 1000 degree furnace and colding it within short minutes. It still won’t break even repeat this test with 100 times.

Material Properties:
* High thermal conductivity
* Excellent thermal shock resistance
* Low thermal expansion
* Exceptional heat resistance
* Good Chemical Inertness
* High electrical resistance
* Low dielectric constant and loss tangent
* High volume resistivity
* Excellent machinability
Grades 5 grades of boron nitrides are involved in Boron Nitride product series.
* BN99 ● CABN ● ALBN ● ZRBN ● ZABN ● SB
Ability
Max size:500x500x200mm
Best tolerance: +/-0.05mm
Thickness: 0.5 to 200mm
High purity and composited Boron Nitride are both available

Material Properties:

ITEM
UNIT
BN-2000
BN-2300
BN-2800
BN-3000
Main Content
BN>99%
BN+Al2O3
BN+AlN
BN+ZrO2
Color
White
Light Grey
Dark Grey
Dark Grey
Density
g/cm3
1.95-2.00
2.25-2.35
2.75-2.85
2.90-3.00
Flexural Strength
Mpa
30
65
85
90
Compressive Strength
Mpa
55
145
205
220
Electrical Resistivity
Ω·cm
>1014
>1013
>1013
>1012
Max. Use Temp. (Air)
°C
900
1,000
1,000
1,000
Max. Use Temp. (Vacuum)
°C
1,900
1,750
1,800
1,750
Max. Use Temp. (Inert)
°C
2,000
1,750
1,800
1,750
Thermal Conductivity
W/m.K
35
30
85
30
CTE (25 – 1,000 °C)
10-6/K
1.5
2
2.8
3.5

High Thermal Conductivity Hexagonal Boron Nitride Ceramic Cylinder

Applications

1. Electronic parts – heat sinks, substrates, coil forms, prototypes
2. Vacuum melting crucibles
3. CVD crucibles
4. Microcircuit packaging
5. Sputtering targets
6. High precision sealing, brazing, and metallizing fixtures
7. Microwave tubes
8. Horizontal caster break rings
9. Low friction seals
10. Plasma arc insulators
11. High temperature furnace fixtures and supports

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