Si3N4 DBC and AMB ceramic substrates
Si3N4 DBC and AMB ceramic substrates With the development of wide bandwidth semiconductors, power semiconductor devices to higher power density, higher chip temperature and higher reliability of the direction of development, and accordingly for the power semiconductor module packaging put forward higher requirements. Including our previous talk about no solder, no bonding wires and other interconnect technology trends, the choice of insulation substrate has also become a frequent topic of discussion. In order to improve the thermal performance of the module, [...]