13 Nov
Aluminium Nitride for semiconductor industry
Aluminium nitride (AlN) with high strength, high volume resistivity, high insulation voltage, thermal expansion coefficient, and silicon match well, etc., not only used as structural ceramics sintering additives or reinforcing phase, especially in the field of ceramic electronic substrate and... read more
13 Nov
Semiconductor Processes – Etching
1, etching process classification:
There are two main types of etching processes in semiconductor manufacturing: dry etching and wet etching. Dry etching is divided into three: plasma etching, ion beam sputtering etching and reactive ion etching (RIE). Of course, etching can also... read more
21 Jul
Advanced Zirconia Ceramics Components for Chemical ProcessingY-TZP zirconia ceramic components have been successfully applied in petrochemical and process industries as valves, seats, bearing and nozzles.
FUBOON specializes in working with manufacturers of basic, intermediate and specialty chemicals, soaps and cleaning compounds; paints, coatings, and adhesives;... read more
21 Jul
Alumina Ceramic Rapid PrototypingPrototypes made of High-Performance Alumina Ceramics in serial quality
Rapid prototyping is our speciality processing. All we need is a CAD or 3d file to get started and since we stock many of the blank ceramic materials, our lead time is just a couple... read more
31 Dec
Ceramic ring for fiber laser cutting machine
The ceramic ring is an important part of the cutting head of the laser cutting machine.
Its main function is to transmit the electrical signals collect by the laser head nozzle,
which plays an important role in the normal... read more
02 Aug
Ceramic components
Many sintered body materials mainly composed of oxides are widely used in the production of electronic functional components. The manufacturing process of electronic ceramics is roughly the same as that of traditional ceramics.
Electronic ceramics, or ceramics for the electronics industry, are fundamentally different... read more
13 Nov
Si3N4 DBC and AMB ceramic substrates
With the development of wide bandwidth semiconductors, power semiconductor devices to higher power density, higher chip temperature and higher reliability of the direction of development, and accordingly for the power semiconductor module packaging put forward higher requirements. Including our... read more
25 Jul
Bulletproof ceramic materials
01The principle of Bulletproof with ceramic materials
The basic principle of armor protection is to dissipate the energy of a projectile, slow it down and render it harmless. Whereas most conventional engineering materials, such as metals, absorb energy through plastic deformation of the... read more
12 May
PCB Ceramic circuit boards
With the continuous upgrading and optimization of electronic products, the requirements of PCB, the carrier of its components, are also constantly improving, resulting in the emergence of ceramic circuit boards. So, what are the advantages of ceramic-based circuit boards over... read more
21 Jul
Ceramic Lids for Hermetic Microelectronic Packages
Ceramic Lids for Non-magnetic Hermetic Microelectronic Packages
Ceramic Lids are used primarily with Cerquad packages that require a glass or B-staged epoxy coated seal.
Ceramic Lids FeaturesAvailable in a wide variety of shapes, sizes and thickness
Low tempearture epoxy or glass seal
Solid... read more